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z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) specification SPW08F0D customer customer customer customer approval approval drawn ssc ssc ssc ssc
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) SPW08F0D 1. description 2. absolute maximum ratings 3. electro- optical characteristics 4. characteristic diagram 5. reliability 6. cie chromaticity diagram 7. binning table 8. outline dimension 9. reel structure 10. packing 11. soldering 12. precaution for use 13. handling of silicon resin leds
z-power led x10490 technical data sheet ???? : ssc- qp- 7- 07- 24 (rev.00) rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com SPW08F0D features applications it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame (au plating). the die is attached within the reflector cavity and the cavity is encapsulated by silicone the high reliability feature is crucial to automoti ve front, interior lamp and general lights 1. description SPW08F0D ? industry standard smt package ? low thermal resistance ? lead free product ? rohs compliant ? daytime running lamp (drl) ? position lamp ? front fog lamp ? automotive interior lamp ? interior lighting ? general lighting ? indoor and outdoor displays ? electronic signs and signals
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 2. absolute maximum ratings k/w 40 r th-ja 150 t j junction temperature -40 ~ +125 t stg storage temperature k/w 12 r th-js thermal resistance *2 -40 ~ +125 t opr operating temperature ma 100 (min.) 350 (typ.) 500 (max.) i f forward current (ta = 25 ) w 2.0 p d power dissipation *1 unit value symbol parameter * 1. care is to be taken that power dissipation does not exceed the absolute maximum rating of the prod uct. * 2. mounted on metal pcb, area of 950mm 2 per led. r th-jc is junction to case (bottom of metal pcb) temp. 3. electro-optical characteristics * 1. the luminous flux was measured at the peak of t he spatial pattern which may not be aligned with the mechanical axis of the led package. luminous fl ux measurement allowance is 10% * 2 measurement uncertainty of the color coordinate s is 0.01 * 3. 2 ? is the off- axis where the luminous intensity is 1/ 2 of the peak intensity. - 0.33 - y deg. 120 i f =350ma 2 ? viewing angle *3 - - 0.33 - i f =350ma x color coordinate (x,y) *2 lm 91 - 70 i f =350ma v luminance flux *1 v 3.8 3.5 - i f =350ma v f forward voltage unit max typ min condition symbol parameter
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 100 200 300 400 -0.020 -0.015 -0.010 -0.005 0.000 0.005 0.010 0.015 0.020 x axis y axis 4. characteristic diagram ( t a =25 o c ) forward current vs. forward voltage relative luminous intensity vs forward current ( t a =25 o c ) forward voltage v f (v) forward current i f [ma] forward current i f [ma] color coordinate shift vs. forward current forward current i f [ma] color coordinate shift (x,y) ( t a =25 o c ) relative luminous flux (lm/lm) 400 450 500 550 600 650 700 750 spectrum wavelength [nm] ( t a =25 , i f =350ma) 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 0 100 200 300 400 500 100 200 300 400 500 0.0 0.5 1.0 1.5
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) -60 -40 -20 0 20 40 60 80 100 120 140 -0.020 -0.015 -0.010 -0.005 0.000 0.005 0.010 x axis y axis -60 -40 -20 0 20 40 60 80 100 120 140 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 -60 -40 -20 0 20 40 60 80 100 120 140 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 ( i f =350ma) relative forward voltage vs. junction temperature relative luminous intensity vs. junction temperatur e ( i f =350ma) junction temperature [ t j ] relative forward voltage v f (v) junction temperature [ t j ] color coordinate shift vs. junction temperature junction temperature [ t j ] color coordinate shift (x,y) ( i f =350ma) relative luminous flux (lm/lm) -100 -80 -60 -40 -20 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 x axis y axis radiation diagram angle [deg.] intensity 4. characteristic diagram ( t a =25 , i f =350ma)
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) max. permissible forward current temperature [ t ] 4. characteristic diagram 0 20 40 60 80 100 120 140 0 100 200 300 400 500 600 forward current i f [ma] t a : ambient temp. t c : case temp. t a t c
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 5. reliability usl *1 1.2 lsl *2 0.8 i f =350ma v luminous flux usl *1 1.2 lsl *2 0.8 i f =350ma v f forward voltage max min criteria for judgement condition symbol item note : *1 usl : upper standard level *2 lsl : lower standard level ? ?? ? criteria for judging the damage 0/77 1000 hours ta= 25 c, if = 350 ma - room temperature operating life 0/30 - 1500 g's for 0.5 ms, 5 blows, 3 orientations jesd22 b-104 mechanical shock 0/30 - 0.06 inch displacement, 20 to 100 hz, 50g 100 hz to 2khz, jesd22 b-103 vibration variable frequency 0/30 - hbm = 2kv aec-q101-001, 002, 005 esd characterization 0/77 1000 hours ta=100 c jesd22 a-103b high temperature storage life 0/77 1000 hours ta= -40 c jesd22 a-119 low temperature storage life 0/77 1000 hours 85 c/85% rh, if = 350 ma jesd22 a-101 high humidity high temp. reverse bias 0/77 1000 hours ta= 100 c, if = 300 ma jesd22 a-108c high temperature operating life 0/77 1000 hours ta= -40 c, if = 350 ma jesd22 a-108c low temperature operating life 0/77 1000 cycle tc=-40 c/100 c, if =350 ma, 10 min dwell / 20 min transition (1 hour cycle), 2 min on / 2 min off, 1000 cycles jesd22 a-105 power and temperature cycle 0/77 1000 cycle tc= -40 100 c, 30 min dwell, 5 min transfer jesd22 a-104 temperature cycling 0/77 1000 cycle -40 c/100 c, 20 min dwell, <10 second transfer jesd22 a-104 thermal shock number of damage duration / cycle test description (as performed by supplier) reference specification stress
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 6. cie chromaticity diagram [ta = 25 if = 350ma]
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 7. binning table 80 70 t1 91 80 t2 70 60 s2 max. min. bin code luminous flux (lm) @ i f = 350ma bin code i forward voltage (v) @ i f = 350ma t1 luminous flux (lm) @ i f = 350ma b0 color chromaticity coordinate @ i f = 350ma available ranks 3.6 3.4 j 3.4 3.2 i 3.2 3.0 h 3.8 3.6 k max. min. bin code forward voltage (v) @ i f = 350ma max. min. bin code ref. 9 pages color chromaticity coordinate @ i f = 350ma
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 8.outline dimension ( tolerance: 0.2, unit: mm ) < package outline > < circuit diagram > < solder pattern >
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 180 2 13 22 60 15.4 1.0 13 0.3 9. reel structure ( tolerance: 0.2, unit: mm ) (1) quantity : 1,500pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion stre ngth to be 0.1-0.7n when the cover tape is turned o ff from the carrier tape at the angle of 10o to the carrier tape (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package 4.80 0.1 (4.75) 12.0 0.2 5.30 0.1 1.30 0.1 1.75 0.1 5.5 0.05 0.25 0.05 4 0.1 2 0.05 8.0 0.1 1 . 5 + 0 . 1 , - 0 1 . 5 m i n package marking
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 10. packing
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 11. soldering 10 sec. max. soldering time condition 240 max. peak-temperature 120 sec. max. pre-heat time 120~150 pre-heat lead solder 10 sec. max. soldering time condition 260 max. peak-temperature 120 sec. max. pre-heat time 150~200 pre-heat lead free solder lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. (1) lead solder (2) lead-free solder (3) hand soldering conditions do not exceed 4 seconds at maximum 315oc under sold ering iron. (4) the encapsulated material of the leds is silicon e. precautions should be taken to avoid the strong pre ssure on the encapsulated part. so when using the chip mounter, the picking up nozz le that does not affect the silicone resign should be used. note : in case that the soldered products are reuse d in soldering process, we dont guarantee the prod ucts. lead-free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max.
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 12. precaution for use (1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box with a desiccant. otherwise, to store them in the f ollowing environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh (2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing t he light intensity to drop. attention in followed; keeping of a fraction temperature : 5 ~ 40oc humidity : less than 10% (3) in the case of more than 4 week passed after op ening or change color of indicator on desiccant, components shall be dried 1 0-12hr. at 60 5oc. (4) any mechanical force or any excess vibration sh all not be accepted to apply during cooling process to normal temperature after soldering. (5) quick cooling shall be avoided. (6) components shall not be mounted on warped direc tion of pcb. (7) anti radioactive ray design is not considered f or the products. (8) this device should not be used in any type of f luid such as water, oil, organic solvent etc. when washing is required, ipa should b e used. (9) when the leds are illuminating, operating curren t should be decided after considering the ambient maximum temperature. (10) the leds must be soldered within seven days aft er opening the moisture-proof packing. (11) repack unused products with anti-moisture pack ing, fold to close any opening and then store in a dry place. (12) the appearance and specifications of the produ ct may be modified for improvement without notice. (13) silver plating becomes tarnished when being ex posed to an environment which contains corrosive gases any product with tarnished leads ma y lead to poor solderability and deterioration of optical characteristics . please d o not expose the product to corrosive atmosphere during storage
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 december. 2010. december. 2010. www.acriche.com www.acriche.com ???? : ssc- qp- 7- 07- 24 (rev.00) 13. handling of silicone resin leds (1) during processing, mechanical stress on the sur face should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surfac e can also become scratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, ex cept that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the hand ling of such devices. compared to standard encapsulants, silicone is generally softer , and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level o f dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be ap plied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleani ng. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led.

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